The company was founded in September 2021, the registered capital of 15 million yuan.
       Focus on laser stealth cutting technology, R & D positioning is to break the monopoly of Japan and Germany wafer semiconductor laser processing equipment, market-oriented is mobile phones, car and security cameras, optical coating glass cutting, LED, silicon stealth cutting and other fields. 2022 has developed a filter without microcracking laser equipment, to fill the blank of domestic wafer stealth cutting.
      Independent intellectual property rights 21 pieces, including 3 invention patents;
      The products are positioned as a series of silicon carbide stealth cutting equipment applied in the fields of 3c filters, led, car drones, security, new energy vehicle nano-film glass and so on;
      Won the first place in 2022 Suzhou Jinji Lake Youth Science and Innovation Competition;
      Obtained 2023 Gusu Innovation and Entrepreneurship Leading Talent.