Replacing the traditional film removal process for coated glass, we have realised a film removal equipment that can avoid environmental pollution, save consumables, and produce film in a simple, fast and automated way.

Processed with a Bessel focusing head, the high peak power and high peak power density of the Bessel beam is focused inside the glass, instantly vaporising the material in the area to produce a vaporised zone, which rapidly spreads to the upper and lower surfaces to form a crack. The cutting cross-section consists of a myriad of apertures, which are cut by external stress fracture.

Laser technology has penetrated the semiconductor industry and laser processing equipment has been successfully used in the semiconductor field. Highly integrated and high-performance semiconductor wafer demand continues to grow, silicon, silicon carbide, sapphire, glass and indium phosphide and other materials as substrate materials are widely used in the field of semiconductor wafers, laser in the semiconductor industry, glass, sapphire, ceramics and other brittle materials such as precision drilling and cutting, wafer scribing and cutting, etc., has achieved good results in the application of results.

With the advancement of science and technology, the popularity of the Internet and the improvement of people's living standards, a wealth of consumer electronic products, such as mobile phones, TVs, MP3s, computers, tablets, cameras, wearable smart devices and so on, are changing people's lives in a subtle way.