Processed with a Bessel focusing head, the high peak power and high peak power density of the Bessel beam is focused inside the glass, instantly vaporising the material in the area to produce a vaporised zone, which rapidly spreads to the upper and lower surfaces to form a crack. The cutting cross-section consists of a myriad of apertures, which are cut by external stress fracture.

Combines glass cutting, punching and scribing in one unit. Using a picosecond laser through a high-precision motion system, it achieves high-precision, small chipping, dimensionless, single blade 15MM to 19MM glass cutting.