I. Product description
Equipment introduction:
1, laser technology has penetrated into the semiconductor industry, laser processing equipment in the semiconductor field has been successfully applied. Highly integrated and high-performance semiconductor wafer demand continues to grow, silicon, silicon carbide, sapphire, glass and indium phosphide and other materials as substrate materials are widely used in the field of semiconductor wafers, laser in the semiconductor industry, glass, sapphire, ceramics, and other brittle materials such as precision drilling and cutting, wafer scribing and cutting, etc., has achieved good results in the application of results.
2, with the traditional mechanical way of processing difficulty, processing yield is also very low, and for the processing of thin glass and ultra-thin glass, non-contact laser processing has a huge advantage, can be shaped cutting, drilling, etc., with high precision, chipping small, no cracks, etc., a perfect solution to the display industry due to technological innovations and standards to improve and bring a higher processing requirements. Laser processing technology has been widely used in the processing of mobile phone panel glass and sapphire, display panel, touch screen and other fields.

Schema

(Subject to actual delivery)

 -High efficiency: adopting domestic high-quality laser, good beam quality, fast processing speed;
- High accuracy: adopting high-precision fast scanning galvanometer, small heat-affected area;
- High yield: equipped with high stability working platform, large processing width;
- Low cost: direct moulding, no need to grind and polish;
- Low energy consumption: energy saving and environmental protection, low power consumption;
- Low maintenance: non-contact processing, no consumables, low running costs, optical path is basically maintenance-free.

Sample Display：

Model:HSYQ355-10B/T
Version number:20210720 
 

● Product design performance characteristics:

1、Linear high-speed platform (X/Y axis): easy to maintain, long life, high precision, fast speed;
2 、High-definition CCD industrial camera: (coaxial, high and low times, panoramic, under the CCD) positioning speed, high precision;
3, LED light source: under the flat red and white light source, coaxial light source, high subdivision, uniform brightness, long service life;
4, software: beautiful interface, simple operation, high functional compatibility, easy for newcomers to get started;
5, processing type: silicon carbide wafer;
6, cutting mode: self-developed multi-type unique cutting mode;
7, equipment options are rich, convenient for later equipment upgrades and transformation;
8, focus meter: side axis altimeter, coaxial camera focus;
9、Feeding, cutting, dispensing, cleaning, air-drying, and rewinding can be carried out at the same time.
 

● Product specific applications: 

Silicon carbide wafer cutting. 

● Key Clients: 

Sanan Optoelectronics, Huacan Optoelectronics, Tongfu Microelectronics, etc.