1、 Basic information:
1. Application areas: White and black PDLC dimming films, as well as various colored PDLC liquid crystal dye dimming films that may appear later. The film structure is shown in Figure 1:
2. Incoming material specifications: 50mm * 50mm -1800mm * 1350mm, thickness 0.5 ± 0.1mm, ITO transparent conductive layer, liquid crystal layer non transparent layer.
3. Processing method: Processing with PE or PET protective film, laser surface cutting to achieve semi cutting PET and cutting protective film functions, as shown in Figure 2-5.
4. Processing area: As shown in Figures 4-5, different products may vary.
2、 Main technical features:
1. Half cutting process:
1) Characteristics of laser half cut PET: It does not damage the ITO layer, can be completely cut in one go (only one cut), and has no defects such as burnt yellow, blackened, melted edge, adhesion, burrs, material damage, etc. on the cutting edge. The power on detection partition function is normal;
2) Characteristics of laser cutting for protective film: After cutting, the cutting part can be completely peeled off without adhesion, and the PET layer and ITO layer under the protective film can be cut without damage.
3) Characteristics of groove cutting: one-time cutting, no defects such as uncut when torn open.
4) When cutting the same line segment, different cutting powers can be adjusted in different zones, and the cutting power alternately connects without cutting damage or penetration; The laser cutting has consistent horizontal and vertical power.
5) Can cut corners of R2 and above without cutting or penetrating.
6) Accuracy requirements: The shape, contour, and dimension accuracy should be less than ± 0.1mm, and the deviation of the process groove width and groove width should be ± 0.1mm.
3、 Main indicator requirements
Project | Unit | Specification requirements | Notes |
Processing speed | mm/s | >200mm/s | Comprehensive speed |
Accuracy requirements | mm | <±0.1mm | Shape, contour, size accuracy |
Target recognition success rate | % | >100% | According to the sample provided by the demander |
Table flatness | mm | <±0.05mm | |
Equipment time utilization rate | % | ≥95% | (Equipment load time - Equipment abnormal shutdown time)/Equipment load time] * 100% |
Production yield rate | % | ≥99.8% | Excluding defects caused by production materials and handling issues |