Laser Stealth Cutting Equipment in the Semiconductor Industry

In the production of IC products, due to the complexity of the process, in order to ensure the traceability of the entire process chain, without damaging the premise of the components, it is necessary to be in a specific position of the IC has been sealed plastic, marked with a clear flow number, product name, manufacturer and other information corresponding to a specific string.

As the size of the chip is getting smaller and smaller, the characters engraved are getting smaller and smaller, and the requirements for marking accuracy are getting higher and higher. For IC marking requirements, combined with its own laser process, launched a complete set of fully automated high-precision semiconductor marking system solutions, and applied in actual production.

In order to ensure processing accuracy and yield control, semiconductor PLC control system, vision system, optical system, software system and other aspects of optimisation and technological breakthroughs. It can be applied to the packaging back-end of the semiconductor industry to meet the marking of various leadframe and substrate IC products such as SOP, QFN, LGA, BGA, and so on.