High-precision glass micromachining technology: laser-induced etching rapid prototyping technology

The share of packaging in the semiconductor industry has steadily increased in response to the demand for miniaturisation, multifunctionality and shorter development cycles for electronic components. The development of packaging technology has benefited from the evolution of through-hole interconnection technology and the significant improvement in processing accuracy.

Silicon through-hole and glass through-hole are two commonly used through-hole interconnect processing methods. Compared with silicon, glass has excellent high-frequency electrical characteristics, strong mechanical stability, low cost, unlimited width, etc. Therefore, silicon through-hole technology is widely used in RF components, optoelectronic devices, MEMS devices and other special applications.

With the thinning of glass, traditional glass processing methods are unable to meet the processing requirements of small aperture, large aspect ratio, fine pitch and high consistency due to their own limitations. For this reason the industry has come up with different new process ideas for through-hole reliability studies.

Laser-induced etching rapid prototyping technology is the use of ultra-fast lasers for directional modification of glass, and then the subsequent chemical etching of the glass modification channel to amplify the formation of through-holes. The technology is based on the use of ultra-fast laser light in the glass material, so that the corresponding region of the phase change, and then the phase change region in the chemical etching process to show different corrosion efficiency. The very small focusing spot and high roundness of the laser ensures the consistency of the micro-hole shape and size, and the flexibility of the flexible laser processing system ensures that the product designer can create a unique design according to his own needs, improving the efficiency, quality and reliability of the mass production.